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International Microelectronics And Packaging Society (IMAPS) 2017

Raleigh Convention Center 500 S Salisbury St, Raleigh, NC, United States

Microelectronics packaging, whether in organic or glass substrates, is a hot topic floating around the electronics industry.  At this years iMAPS convention, packaging will play a crucial role in product and design as guest speakers, students, and innovators come together to understand and implement future developments. This proprietary process combines the performance benefits of glass with small […]

Advanced Packaging for Medical Microelectronics 2018

Handlery Hotel 950 Hotel Cir N, San Diego, CA, United States

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop […]

International Microelectronics And Packaging Society (IMAPS) Device Packaging 2018

The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting […]

ECTC 2018

Sheraton San Diego Hotel & Marina 1380 Harbor Island Dr, San Diego, CA, United States

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2018 ECTC will be held at The Sheraton […]

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