THE SAMTEC BLOG
The 29th Annual Electronics Packaging Symposium (EPS) is the premier electronics manufacturing conference of the Northeast, bringing together the best and brightest in the international electronics packaging industry. The 2017 Symposium will be held at GE Global Research in Niskayuna, New York, September 19-20, 2017 and will feature over 40 invited technical presentations and keynote […]
Microelectronics packaging, whether in organic or glass substrates, is a hot topic floating around the electronics industry. At this years iMAPS convention, packaging will play a crucial role in product and design as guest speakers, students, and innovators come together to understand and implement future developments. This proprietary process combines the performance benefits of glass with small […]
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop […]
The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting […]