Samtec next-generation interconnect solutions are designed with the flexibility and performance to meet the challenges of 224 Gbps PAM4 architectures. Emerging system requirements are driven by industry advancements in areas such as data centers, artificial intelligence (AI), machine learning (ML), and quantum computing, and Samtec’s products and roadmaps are carefully designed to satisfy these high-performance needs.
On-Package or ASIC-Adjacent Cable System
- Industry’s highest-density on-package or ASIC-adjacent cable system
- 207 differential pairs per square inch
- Eye Speed® AIR™ hyper low skew 33 AWG twinax cable
- Samtec Flyover® Cable Technology
- Designed for HDI & package substrates
OSFP 224 Gbps PAM4 Panel Assembly
- Up to 1.6 Tbps aggregate data rate
- Eye Speed® AIR™ hyper low skew 33 AWG twinax cable
- Samtec Flyover® Cable Technology
- Excellent thermal performance
- Direct attach contacts for optimized signal integrity
High-Density Mezzanine System
- Industry’s highest-density board-to-board and on-package mezzanine system
- 64 pairs in a 14 x 14 mm footprint
- Low profile design
- Up to 6.4 Tbps aggregate data rate
Extreme Performance Backplane System
- Eye Speed® AIR™ hyper low skew 33 AWG twinax cable
- 146 differential pairs per square inch
- Samtec Flyover® Cable Technology
- End 2 design flexibility
- Cable-to-cable connectivity
Enabling Technologies
90 GHz High-Performance Test System
- High-density design for smaller evaluation boards, shorter traces
- 1 mm connectors on cable end for direct connection to test equipment
- Solderless design improves costs and ease of use in lab settings vs traditional connectors
- Ideal for SerDes characterization, CDR, mmWave radar, ATE, 5G FR2 networks
Eye Speed® AIR™
- Best SI performance: lower dK + 33 AWG
- Foamed dielectric twinax
- Low intra-pair skew
- Best flexibility
Signal Integrity, Support
