Since we missed OFC 2020 and the opportunity to meet with our customers and blog readers in person, we decided to bring the show to you. We had an incredible booth planned with six live product demonstrations and multiple new product introductions.
OFC has always been the single best place in the optics industry to meet with customers and partners, address the technical challenges with next generation systems, and demonstrate Samtec’s industry leadership. This time we had planned to demo multiple high-speed copper and optical interconnect solutions at speeds up to 56 and 112Gbps PAM4
Our engineering team put together a series of videos that gives very brief overviews of the key product demonstrations that we had planned for OFC 2020. So, sit back and enjoy the show!
Direct Connect™ To Silicon Package
Samtec Direct Connect™ technology enables 56 Gbps PAM4 and 112 Gbps PAM4 systems that eludes BGA traces. With Direct Connect, Samtec Flyover® cable assemblies plug directly into the package. This is an enabler for many other technologies, including AI, machine learning, 5G, emulation, and high-performance computing.
Si-Fly™ is a new, Direct Connect 112 Gbps PAM4, low-profile, high-density cable system.
112 Gbps PAM4 QSFP-DD Connector System Enabled By Samtec Flyover
This demo, a collaboration between Samtec and Alphawave, emulates next generation data center equipment architectures, and incorporates Samtec Flyover® to improve signal integrity and architectural flexibility. Samtec Flyover routes critical high-speed signals from the ASIC, above lossy PCB materials, directly to the panel, utilizing ultra-low-skew twinax cable.
PCIe® Over Fiber
In this application, instead of inserting a video card directly into the host system PCI Express slot, a FireFly™ optical interconnect allows the motherboard PCI Express bus to be “extended” to a remote location. Products and technologies featured in this demonstration include Samtec FireFly the PCUO series and the PCOA add-on card.
Immersion Cooling of Optical Transceiver, PCB
This is a live demonstration of an immersion cooling system with a submersible optical Samtec FireFly transceiver running at 112 Gpbs (x4-28 Gbps/lane).
Connector Systems For AI Hardware Design
Ralph Page walks us through a live demonstration of a prototypical AI (artificial intelligence) hardware design. It’s a configurable, next-generation, possibly GPU-based system that combines a cable mesh backplane, a rigid-style backplane, high-speed edge card connectors, and precision RF interconnects. Products discussed include the AcceleRate® high-speed cable system and HSEC6 edge card connector system.
Salt-Fog Resistant Connector Systems
This proprietary Samtec solution makes both Samtec copper and optical FireFly connector systems salt and fog resistant. It’s particularly beneficial for aviation and military industries.
Samtec products on display at OFC and in the live demonstrations:
- NovaRay® 112 Gbps PAM4 Extreme Density Arrays
- AcceleRate® Slim Body Direct Attach Cable Assemblies
- Samtec Flyover®
- FireFly™ Copper and Optical Micro Connector System
- Si-Fly™ 112 Gbps PAM4, Low Profile, High Density Cable System
- ExaMAX® High-Speed Backplane System
- HSEC6 (High Speed Edge Card Systems)
- Bulls Eye® High-Performance Test System To 70 GHz
- Precision RF
Literature and data sheets:
- Technology Roadmap
- NovaRay e-brochure
- AcceleRate e-brochure
- AcceleRate HD e-brochure
- Si-Fly e-brochure
- AI Systems
- mPower™ e-brochure
- High Speed Cable Guide
- FireFly Application Design Guide
- High Speed Board-to-Board & Backplane Guide
- Precision RF Guide
- Bulls Eye Application Guide (High-Performance Test Solutions)