International Microelectronics And Packaging Society (IMAPS)

Although many advances continue to be made in the field of microelectronics, packaging is normally not in the spotlight.  However, at this years iMAPS convention, packaging will play a crucial role in product and design as guest speakers, students, and innovators come together to understand and implement future developments.

Samtec will be attending iMaps on October 11, 12 at Booth 509 and featuring our new Glass Core Technology (GCT).

This proprietary process combines the performance benefits of glass with small diameter, fine pitch Through-Glass Vias (TGVs) and unique thin-film Redistribution Layers (RDL) for use in next-generation IC packaging. This revolutionary process enables performance optimized, ultra-miniaturized IC packages and modules.

Topics and features to be considered include:

• Over 120 vendor booths exhibiting new technology.
• Guest speakers offering hands-on, technical sessions.
• Continuing developments in microelectronic packaging, from fan-out wafer level to embedded designs.

For additional information and registration, please visit http://www.imaps.org/imaps2016.