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October 8, 2018 @ 9:00 am - October 11, 2018 @ 5:00 pm
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:
- SiP/SiM (System Solutions)
- Wafer Level/Panel Level (Advanced RDL)
- High Performance / High Reliability
- Flip Chip/2.5D/3D/Optical (Advanced Package)
- Advanced Process & Materials (Enabling Technologies)