EDI CON 2018

EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today’s communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. Samtec will be attending EDI CON from October 17-19 and be featuring our RF interconnect solutions, and high-speed/high-density interconnect systems. For more information, please visit the show’s official website. Make sure check out Samtec’s workshops:

• Evaluating Connector Crosstalk Impact on System Crosstalk at 32Gbps (PCIE Gen5) at 12:55 pm – 1:35 P.M. on Thursday, 18 October 2018 in Room 209
• Increasing Broadband Interconnect Characterization up to 60GHz at 2:25 pm – 3:05 P.M. on Thursday, 18 October 2018 in Room 209