Samtec’s AcceleRate® HP Cable assembly system consists of an ARP6 cable assembly mating to an APF6-L pcb connector. Design elements include:
- Extremely high density
- 112 Gbps PAM4 capable
- BGA solder ball attach
- 34 AWG Ultra-Low Skew Twinax or 36 AWG Micro-Coax
- 4, 6, 8 rows with 8 or 12 DP per row
- 32 to 96 differential pairs
- Vertical height < 15 mm
- Squeeze latch or extraction tool configurations
- 0.635 mm pitch within a row
- 2.20 x 2.40 mm pitch row-to-row
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