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Mentor®, A Siemens Business 2017 (PCB Forum Ottawa, Ontario)
May 16, 2017
Increasing design complexity. Growing global market pressures. Greater demands for more differentiated, reliable products in less time. For creators of electronic products, it can be challenging to keep up with constant industry changes. But why adapt when you can be the driver of change?
This year, Mentor Graphics hosts a global PCB Forum that explores how organizations can accelerate smart innovation, putting themselves ahead of the curve in PCB systems design.
Technical training/marketing will be provided through various Samtec FAEs, product managers and Mentor’s own toolset for each of the shows. The following will be presented by representatives of Samtec:
Enabling PCB Design and Layout from DC to 56 Gbps presented by Anthony Fellbaum, Samtec
PCB design and layout design requirements grow as high-speed serial channel data rates become faster. Optimized channel performance demands access to the latest tools, resources, and service in current and next generation data rates. Technical experts from Samtec will review the evolution of high data rate serial channels while highlighting an ecosystem of design support available for PCB designers and layout engineers.
28Gbps/56Gbps Channel SI/PI Optimization and Design Challenges presented by Rod Strange, Teraspeed Consulting
High-speed serial data channels (28Gbps/56Gbps) proliferate unabated across many applications. Despite a corresponding increase in technical articles, support, tools and resources, many engineers lack the experience and confidence to design and optimize 28Gbps/56Gbps channels. This course will explore high-level design challenges in 28Gbps/56Gbps channels and provide design tips and techniques to optimize SI and PI in 28Gbps/56Gbps channels.
Admission and parking for each forum is free and includes all technical sessions, lunch and a networking reception at the end of the day.