More than just bringing professionals together from different parts of the globe, IWLPC strives to address the most formidable of tasks when it comes to wafer packaging.
Starting into its 14th year with support from entities like Chip Scale Review
, IWLPC continues to grow in attendance as well as exhibitions offering 60+ this year. Other key features include:
- 3 core information tracks (MEMS, WLP, and 3D)
- 2 full days of exhibitions and demonstrations
- Various opportunities to capitalize on new technologies and industry trends
will be attending and will be featuring its Microelectronics
solutions at IWLPC from October 24 to October 25 in San Jose, California. For more information and to register, please visit the show’s official website