iMAPS 2019

The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). As our industry grows, we see a continuing trend where semiconductor products span many packaging platforms. As a result, we have maintained last year’s technical program format where the tracks are alignment by package platform to improve the overall attendee’s experience. Key package platforms include SiP/SiM/CPI, Wafer Level/Panel Level, 2.5D/3D/Flip Chip/Optical, as well as High Rel/Performance and Advanced Process/Materials. The technical committee has put together over 125 technical presentations and posters on today’s most relevant topics in five parallel technical tracks.

Samtec will be displaying its Glass Core Technology. For more information, please see www.samtec.com/gct.