September 30, 2019 @ 8:00 am – October 3, 2019 @ 5:00 pm
The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). As our industry grows, we see a continuing trend where semiconductor products span many packaging platforms. As a result, we have maintained last year’s technical program format where the tracks are alignment by package platform to improve the overall attendee’s experience. Key package platforms include SiP/SiM/CPI, Wafer Level/Panel Level, 2.5D/3D/Flip Chip/Optical, as well as High Rel/Performance and Advanced Process/Materials. The technical committee has put together over 125 technical presentations and posters on today’s most relevant topics in five parallel technical tracks.