THE SAMTEC BLOG
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IEEE CPMT Symposium 2017
November 20, 2017 @ 8:00 am - November 22, 2017 @ 5:00 pm
Technology is only as effective as the packaging it comes in, in this case, packaging for micro-electronics. IEEE’s CPMT (Components, Packaging, Manufacturing, and Technology) division is hosting this year’s annual symposium discussing these needs.
“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ provides a platform to communicate and interact with global leaders in packaging technology. Key topics include:
- 3D Packaging & Chip on Chip
- Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP
- Signal Integrity/Power Integrity
- Packaging for Automotive & Power Electronics
- And much more…
Samtec will be attending IEEE CPMT from November 20-22 in Kyoto, Japan. In addition, Kevin Burt of Samtec’s Optical Group, will be presenting the white paper entitled: “Key design elements of a High Density Mid Board Optical Interconnect”. For more information, please visit the show’s official website.