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IEEE CPMT Symposium 2017

November 20, 2017 @ 8:00 am - November 22, 2017 @ 5:00 pm

Technology is only as effective as the packaging it comes in, in this case, packaging for micro-electronics.  IEEE’s CPMT (Components, Packaging, Manufacturing, and Technology) division is hosting this year’s annual symposium discussing these needs.

“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November.  ICSJ provides a platform to communicate and interact with global leaders in packaging technology.  Key topics include:

  • 3D Packaging & Chip on Chip
  • Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP
  • Signal Integrity/Power Integrity
  • Packaging for Automotive & Power Electronics
  • And much more…

Samtec will be attending IEEE CPMT from November 20-22 in Kyoto, Japan.  In addition, Kevin Burt of Samtec’s Optical Group, will be presenting the white paper entitled: “Key design elements of a High Density Mid Board Optical Interconnect”.  For more information, please visit the show’s official website.

Details

Start:
November 20, 2017 @ 8:00 am
End:
November 22, 2017 @ 5:00 pm
Event Category:
Event Tags:
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Website:
http://www.ieee-csj.org/index.html

Organizer

IEEE
Phone:
1 (800) 678-4333
Website:
https://www.ieee.org/index.html

Venue

Kyoto University Clock Tower Centennial Hall
Yoshida-Honmachi
Sakyo-ku, Kyoto 606-8501 Japan
+ Google Map
Phone:
075-753-2285
Website:
http://www.kyoto-u.ac.jp/en/about/profile/facilities/staff/clocktower

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