OFC 2017, The Optical Networking and Communication Conference & Exhibition, is a global forum and exhibition for optical communications and networking possibilities. Samtec will showcase the latest FireFly™ Optical Cable Systems, including new PCIe® Over Fiber, extended temperature, and low-profile designs. We will also discuss how the Samtec FireFly™ connector was adopted by the Consortium for On Board Optics, and we will run four product demonstrations, among others. OFC … [Read more...]
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Samtec Demos Flyover QSFP In Xilinx VCU118 Demonstration Board At DesignCon 2017
One of several demonstrations at DesignCon 2017 shows the variety of Samtec interconnects supporting the Xilinx® Virtex® UltraScale+ FPGA VCU118 Development Kit. Included in the kit is an FMC+ Active Loopback Card, which carries Samtec's direct attach Flyover™ QSFP28. In the Flyover QSFP28 demonstration, four GT 28 Gbps transceiver signals are generated by the FPGA and launched mid-board from the FireFly™ connector system. These 28 Gbps signals “flyover” the board … [Read more...]
Flyover QSFP28 For 56+ Gbps Applications
At DesignCon 2017, Jim Nadolny, Samtec's Principle SI and EMI Engineer, presented(1) a technical paper entitled “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.” This white paper discusses the Flyover QSFP (FQSFP) approach for 56+ Gbps applications to overcome the limitations from the large loss on typical QSFP ports with surface mount to PCB traces. By replacing the PCB traces to twinax cables, they achieved 7 dB lower insertion loss at 40 GHz -- compared to … [Read more...]
Samtec Releases FireFly™ Application Design Guide
As the demand for bandwidth increases, so does the demand for higher capacity products with faster transmission capabilities. In response to these demands, Samtec has expanded the FireFly™ Micro Flyover Optical product line to solve more complex design hurdles. Benefits such as copper and optical interchangeability, a small footprint for extreme high-density, high-speed 28+ Gbps performance and a simple assembly process makes FireFly™ the ideal solution for mid-board optics … [Read more...]
Samtec Expands ExaMAX® High-Speed Backplane Connector System
Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and … [Read more...]
28 Gbps Backplane Demo Using Virtex UltraScale FPGAs and Samtec Backplane System
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
How to Carry Analog, Digital, and Power in One Connector
In a recently published white paper, “Array Connectors for Mixed Signal Multi-Channel RFSoCs up to 8 GHz,” Samtec engineers describe the research, development, simulation, and measurements performed in a project to design the optimal breakout region (BOR) for the use of array connectors that simultaneously carry analog, digital, and power signals in an RF environment, as a replacement for traditional compression mount and threaded PCB connectors. The results show that it is possible to route … [Read more...]
Introducing AcceleRate® Extreme Density and Performance Systems
The gang’s all here! We’ve recently pulled together Samtec’s family of AcceleRate® products into one webpage so you can easily browse and compare to find the best high-performance solution for your next gen application. The board-to-board and cable assemblies feature extreme density with up to 1,000 total I/Os on a 0.635 mm pitch and extreme 112 Gbps PAM4 performance. So, let’s get this party started with (re)introductions all around… Board-to-Board Interconnects First up is … [Read more...]
New 112 Gbps PAM4 Mid-Board Flyover Cable Solution
In this video from DesignCon 2022, Keith Guetig, High-Speed Product Manager at Samtec, walks us through a live demonstration of a new Samtec high-speed cable system, coupled with new Xilinx advanced silicon, showing a 112 Gbps PAM4 system with outstanding performance. This configuration shows how Samtec Flyover® cable assemblies can be used in mid-board applications. Actually, Samtec Flyover® cable systems can be used in mid-board, mid-board to front panel, mid-board to back panel, and … [Read more...]
DesignCon 22 Preview: New Products, Technologies, Architectures
DesignCon 2022 is next week, April 5-7. Samtec is excited to showcase new products, technologies, and architectures. Our team of signal integrity experts will be presenting papers and will be available to address your design questions at Booth #939. Samtec is prepared for the fast-approaching technical renaissance with innovative Silicon-to-Silicon solutions that exceed standard connectivity demands. New architectures require massive increases in transmission speeds, bandwidths, frequencies, … [Read more...]