THE REAL TOP 10, NOT FAKE NEWS
Wow, so many important, world-shaping events have occured in the first six months of 2018. Mankind experienced the U.S. / North Korea Summit, the royal wedding, the World Cup, and 80+ blogs from Samtec, to name just a few. Since the mainstream media didn’t give the Samtec blog the coverage it deserved, I’ll proudly give you a brief, mid-year review of the Top 10 most popular Samtec blogs, year-to-date:
DISSIMILAR METALS AND THE RISK OF GALVANIC CORROSION IN MATING CONNECTORS: When choosing connectors for your application, it is important to choose mating connectors with similar plating materials in the contact areas. Dissimilar metals in the contact areas (i.e. gold mating with tin) can result in galvanic corrosion. Read more
GUIDELINES FOR PASTE-IN-HOLE REFLOW PROCESSING: Paste-In-Hole (PIH) processing is the process of screening solder paste into and around plated through-holes on a pcb, and placing the leads of through-hole components — like connectors — in these prepared through-holes. The boards are run through a reflow soldering process, thus terminating both through-hole and SMT components in one reflow process. Read more
TI AND SAMTEC DEMO 56 Gbps PAM4 OVER BACKPLANE AT DESIGNCON 2018: TI and Samtec partnered on a 56Gbps PAM4 backplane product demonstration. The demo combined TI’s next-gen 56Gbps PAM4 Linear Repeater with Samtec’s ExaMAX® High-Speed Backplane Connector System. Read more
56 Gbps PAM4 PRODUCT DEMONSTRATIONS AT DESIGNCON 2018: DesignCon is where Samtec showcases new products and product demonstrations that display high-speed technologies for Silicon-to-Silicon optimization. Our demos this year showed interconnect systems in 56 Gbps PAM4, 112 Gbps PAM4, and 28 Gbps applications. This blog is an overview of the demos presented. Read more
MICRO RUGGED CONNECTORS: THEY ARE POSSIBLE: Most designers think the smaller the connector, the more fragile and delicate it is. We don’t usually think of micro pitch connectors as being rugged, as being able to handle high mating cycles, or as having robust mechanical strength on the PCB, or with strong retention of mated connector sets. Read more
SAMTEC AND XILINX 56 Gbps PAM4 BACKPLANE DEMONSTRATION: This combined Xilinx-Samtec 56 Gbps PAM4 backplane demonstration has one port of 56Gbps PAM4 PBRS31 data sourced from the transmitter of the Xilinx test chip containing GTM transceivers. The data routes through high-performance RF jumpers to a test paddleboard made of Isola Tachyon laminate material, through a mated Samtec ExaMAX® high-speed backplane connector set, and then to a backplane also made of Isola Tachyon. Read more
WHAT PLATING OPTION IS BEST FOR MY CONNECTOR?: Choosing the right plating is critical to the success of a connector system. Plating affects the connector’s performance, life cycle, quality, and cost. Read more
SAMTEC PROUDLY SUPPORTS STEM EDUCATION VIA 2018 FIRST ROBOTICS COMPETITION SPONSORSHIP: Experts across multiple industries – including electronics components – agree the need for more scientists, technologists, engineers and mathematicians has never been greater. STEM education remains a constant focus for many industries, governments and universities globally … STEM occupations are projected to grow by 42% faster than non-STEM occupations over the next six years. Read more
KEYSIGHT, SAMTEC 56 Gbps PAM4 QSFP-DD FLYOVER DEMO: Keith Guetig (who is Samtec’s answer to Matt Damon) explains how Samtec Flyover™ designs provide a cost effective, high-performance answer to the challenges of 28 and 56 Gbps bandwidth, and beyond. Read more
CREDO, SAMTEC 400 Gbps IEEE ETHERNET OVER BACKPLANE CABLE ASSEMBLY CONNECTION: This combined Credo/Samtec 400 Gbps IEEE Ethernet over Backplane Cable Assembly demonstration provides proof-of-concept for long reach signals over cabled backplanes. Read more
There’s obviously a lot of interest in cutting-edge high bandwidth applications and demos.
Thanks for a great first six months. We appreciate all of our readers.