SkyRay™, Samtec’s new elevated, high density array interconnect system, offers design flexibility and high bandwidth performance without sacrificing signal integrity. The high speed system supports 28+ Gbps applications, as well as PCIe® and XAUI specifications.
SkyRay is designed for high speed elevated board stacking, with stack heights ranging from 18 mm to 40 mm. The standard stack height is 35 mm. SkyRay is ideal for applications that generate higher levels of heat where airflow management is a concern. Increasing the distance between PCBs can allow for better airflow and improved system cooling.
Here’s How It Works Mechanically
SkyRay is a three-piece solution that consists of two PCB receptacles (one TPAF-M Series, one TPAF-D Series) and one riser, or interposer (TPAR Series). The low profile receptacles (with solder ball termination) allow low thermal mass for easy reflow processing. The TPAF-D and TPAF-M are processed to the two mating boards, and the TPAR connects the two boards by serving as an interface between the TPAF-D and TPAF-M. When un-mating the boards, the TPAR-D (detachable) will unmate first and the TPAR will stay mated to the TPAF-M (mounting). This helps prevent the TPAR interposer from coming free and potentially damaging a component on your PCB.
Here’s How It Works Electrically
High density wafers inside the TPAR Series riser feature a helical crossover design to greatly reduce crosstalk in 100Ω, differential applications. SkyRay utilizes Crosstalk Canceling Technology to maintain signal integrity at elevated stack heights.
- Pair-to-Pair: The design of the insert molded wafer reduces crosstalk by crossing every other pair. Notice the pin pairs in the picture of Wafer A below; they alternate between crossing pairs and non-skew pairs that do not cross. This alternating design decreases crosstalk from pair-to-pair within a row.
- Row-to-Row: Two wafer designs are used in SkyRay. Wafer designs A and B (again, see the picture below) alternate throughout the connector to eliminate crosstalk from row-to-row. Specifically, notice that Wafer A alternates between crossing pairs and non-skew, non-crossing pairs. Wafer B is the reverse – first is a non-skew pair, followed by the crossed pair. Alternating these two wafer designs decreases crosstalk from row-to-row.
- Ground Plane: Finally, each wafer has a full ground plane embedded on the opposite side of the pairs to further reduce crosstalk.
Click here to view a quick video overview of SkyRay.
Tell Me More!
I know what you’re thinking … “please tell me more about this cool product and how it can solve all my interconnect problems!” Glad you asked:
- 35 mm stack height (18 – 40 mm available using a different TPAR interposer)
- Three-piece system for ease of processing
- 28 Gbps+ performance
- Crosstalk canceling technology
- A choice of 1, 2 or 3 module configurations is available (50, 100, and 150 differential pairs)
- 50 differential pairs per module on a staggered 1.50 mm x 1.75 mm pitch
- Wide misalignment tolerances in X-Y axes
- Dual source for Hirose IT5