(This is the third in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled “What Is An RF Connector Launch?” The second is "Via Stubs: Practical Strategies To Mitigate Return Loss.") A wide bandwidth RF launch requires a good ground ring structure around the signal via to maintain the impedance while the signal travels down the via. Figure 1 shows the ground ring … [Read more...]