Check out this video of how Samtec’s ZA8 Series, a high density grid array interposer, self-aligns during reflow. We are frequently asked about the placement and processing of high density arrays. As shown above, the self-centering characteristics of the connector combined with the surface tension of the solder on the board draws the solder ball / interposer contact to the center of the pad.
Of course you also need to closely follow Samtec’s recommended footprint and stencil designs and machine-place the components. If you have questions or need more information, please contact the Interconnect Processing Group at Samtec.
The ZA8 Series is available with either single compression contacts (BGA-style) with solder balls, or dual compression (LGA) contacts for mating directly to the pads on both printed circuit boards.
Z-Ray® micro array interposers are ultra-low profile, high density, highly customizable solutions for board-to-board, IC-to-board, and cable-to-board applications. BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations. The contacts are assembled into rugged low profile FR4 substrate under high pressure and temperature.
Assembly hardware is available for precise alignment, compression, and retention of the interposers to the board. Click here for more info on this hardware.