Samtec’s Z-Ray® micro array interposers are ultra-low profile, high-density, highly customizable solutions for board-to-board, IC-to-board, and cable-to-board applications.
As an interposer, Z-Ray® provides a removable interface between the IC package and main board allowing for future-proofing, upgradability and cost savings during IC and system development.
As a high-speed, high-density array connector, Z-Ray® provides the ultimate in design flexibility from custom heights to full custom geometries for board-to-board applications.
In an effort to help engineers easily adopt this state-of-the art technology, Samtec has released the Z-Ray® Interposer Application Design Guide. This is the first in a series of Application Design Guides that Samtec will release throughout 2016 targeted at easing the design-in process of differentiated interconnect technology Samtec offers.
The new Z-Ray® Interposer Application Design Guide fully explains all the details of the Z-Ray® system. It illustrates the Z-Ray® construction process while showing the flexibility that Z-Ray® micro array interposers provide in various microelectronics packaging applications.
Key sections of the Z-Ray® Interposer Application Design Guide include:
- Interposers: Practical Applications
- Technology/Construction
- Performance Specifications
- Custom Flexibility
- Technology Roadmap
- Interposer Thickness
- Interposer Contact Design
- Interposer Beam Force/Deflection/Resistance
- Z-Ray® Compression Hardware Systems
