Any engineer who has designed an IC-based solution likely used some sort of HW development tool. Semiconductor manufacturers have a long history of providing engineers with the HW tools needed to test their silicon.
Evaluation platforms, like the Xilinx® Zynq UltraScale+ RFSoC ZCU111 Evaluation Kit, provide the ideal development environment for evaluating the cutting edge silicon.
The ZCU111 provides easy access to the power, I/O memory and interface circuitry required for the RFSoC to operate appropriately.
Similar tools are required for interconnect design as well. As data rates increase, engineers selecting high-performance interconnect demand additional design-in support.
Samtec-designed SI Characterization Kits simplify interconnect design, evaluation and testing while reducing time to market.
Kit Features and Benefits
Samtec SI Characterization Kits provide system designers and SI engineers an easy-to-use solution for testing various Samtec high-performance interconnect solutions. The portfolio of solutions includes various mezzanine, backplane and cable assembly applications.
The kits enable correlation between simulated and measured test parameters. Time domain measurements are enabled vis direct connections to TDRs and TDTs. Frequency domain measurements are enabled vis direct connections to VNAs.
Each PCB in a specific kit offers optimized SI performance via Samtec Final Inch® BOR PCB trace routing.
Newly Available SI Characterization Kits
Samtec has released several new product families in recent months. New product launches and product family extensions are on the horizon. Cabled options of several popular mezzanine and backplane connector families will also be available.
Similarly, the Samtec portfolio of SI Characterization Kits has also expanded. Several new solutions are available on request directly from Samtec. New solutions include the following kits:
- AcceleRate® FlyOver SI Characterization Kit
- DCH Flyover SI Characterization Kit
- ECUE FlyOver SI Characterization Kit
- FQSFP SI Characterization Kit
- FQSFP-DD SI Characterization Kits
- ExaMAX® Backplane SI Characterization Kits
- LP Array™ Mezzanine SI Characterization Kit
- Z-Ray® FlyOver SI Characterization Kit
For more information on all of Samtec’s Characterization and Development Kits, please visit www.samtec.com/kits. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional support.