Image Matters High-Performance Platforms Leverage High-Density Samtec Z-Ray® Interposers

All facets of life seem to include videos of some kind.  Social media feeds feature videos from family and friends or possibly that “killer product or service” everybody has to have.  “How-to” and “DIY” videos can be found on any random topic.  The list goes on. Never-ending video consumption by consumers on mobile devices, laptops, TVs or in the movie theatre drives the improved performance of IP networks and video production and distribution equipment.  Computing platforms focused on video and imaging processing must support more pixels, more resolution and more colors to meet consumer demand.

Image Matters ORIGAMI Platform

One new platform targeted at next-generation video and imaging process in the Image Matters ORIGAMI. The two-PCB solution supports video and image compression, transcoding, playing and recording in various formats. The ORIGAMI Module Board features extreme connectivity and processing power. The module’s small size and dedicated Samtec Z-Ray^® Ultra-Low Profile Array allows easy integration onto carrier boards that perfectly fit applications such as advanced video, Pro A/V systems and cloud computing. The ORIGAMI Carrier Board offers a tremendous platform to experiment and deploy high-end video applications using the extreme power and connectivity of the Origami Module. The half-height half-length low profile PCIe size enables easy integration into common PC-based systems. The Z-Ray Interposer between two PCBs contains 1,150 pins.  Each pin can support data rates up to 26 Gbps. The high-performance array enables the ORIGAMI platform to support multiple high-speed I/O formats including HDMI, 12G-SDI, PCIe and 10Gbps Ethernet. For more information about the Image Matters ORIGAMI B20 module, please watch the following video:

Samtec’s Z-Ray^® Ultra-Low Profile Array

Samtec’s Z-Ray^® micro arrays are ultra-low profile, high-density, highly customizable solutions for board-to-board, IC-to-board, and cable-to-board applications. BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into the rugged low-profile FR4 substrate under high pressure and temperature. For additional details on Samtec’s Z-Ray^® Ultra-Low Profile Arrays, please download the following designs:

• Z-Ray^® Interposer Application Design Guide
• Z-Ray^® Compression Hardware Design Guide
• High-Speed Board-to-Board Application Design Guide