Samtec is expanding its line of ExaMAX® high speed backplane connectors. The new system is a direct mate orthogonal (DMO) configuration.
These products were recently on display at SC17 in Denver. In the video above, Jonathan Sprigler, Samtec’s Backplane Product Manager, tells us about the products, their applications, and how they are optimized for speeds up to 56 Gbps, using PAM-4 modulation.
DMO Architecture Improves Electrical Performance
ExaMAX DMO solutions give system designers flexibility by removing the mid-plane, which allows the fabric cards and line cards to mate directly with each other. This architecture increases airflow and improves thermal efficiencies throughout the chassis.
It also improves signal integrity, with shorter trace lengths and fewer connector transitions. And with fewer components, it can streamline the BOM.
Samtec’s ExaMAX DMO system is the EBDM-RA and EBTF-RA series. They’re available in 6 pair and 6, 8, 10, and 12 columns, with guide pin and screw mount options available.
We’ve found that next generation system designers are quickly adopting DMO architectures. Leading equipment vendors from across the data center industry are leveraging the advantages of DMO, including storage, server, networking and other applications.
Traditional Backplane Design
Samtec also has a line of traditional ExaMAX backplane connector systems (the EBTM and EBTF-RA series). In addition, we’re currently developing coplanar and cable solutions. ExaMAX is optimized for speeds up to 56 Gbps, using PAM-4 modulation.
Contact System Reliability
ExaMAX has two reliable points of contact to minimize residual stubs. This improves signal integrity performance, even when subjected to angled mating.
The contact wipe is 2.4 mm. This increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment.
This design has the industry’s lowest mating force, while maintaining excellent normal force as well. All of this is explained in the brief (1:20 long) video above.
The backplane system incorporates individual signal wafers with differential pairs in a staggered design, and is arranged in columns with zero skew.
Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk.
For more information, go to samtec.com/examax, or contact the High Speed Backplane Group.
Other Links That May Of Interest:
- High Speed Board To Board Application Guide
- ExaMAX Application Specification
- ExaMAX Impedance Technical Note