Telecommuting. Mobile work. Remote work. Flexible work. Work from home (WFH). They all mean the same thing. What do all of these have to do with Chalk Talks? Who would have guessed so many would WFH? The global COVID-19 outbreak is the reason. So, staying connected is a must. The demand for data hasn't stopped, yet. That requires continued investment both on the edge and in the data center. More data means more speed. How is Samtec responding? With new Chalk Talks, of course! 0 to … [Read more...]
Optimizing 112 Gbps PAM4 Interconnect Design Leveraging ANSYS® HFSS™
It seems like everyone is thinking about the global coronavirus scare, and rightfully so. Workers, students and those most as risk are staying home. What are people doing at home? They are probably binge-watching their favorite video streaming service. It appears not even COVID-19 can slow consumers' insatiable demand for data. This puts constant pressure on internet providers, equipment vendors and components suppliers to develop higher-performance networks. Samtec is a global leader in … [Read more...]
Three Dimensions for Everyone
When the Boeing 777 first entered service in 1995, it ushered in a new era for commercial aviation. For the first time, Boeing had worked closely with the airlines in the development of a new jet to ensure it satisfied the needs of the end customer. It was also the first Boeing product to incorporate fly-by-wire technology, the flight control system that had been so successful in military aircraft and Boeing's largest competitor, Airbus. More importantly for engineers, the … [Read more...]
Thermal Modeling for Systems
Long gone are the days of simply selling a part, pins in plastic if you will. Between environmental standards, qualification testing, UL ratings, and thermal models; customers have come to expect information about the products they purchase as well. Thermal modeling is one of the many capabilities that Samtec has added, and is utilized during the design process for its products as well as assisting its customers in the design of their systems. What Factors Affect Thermal … [Read more...]
Samtec Exhibits at XDF 2019 Asia in Beijing
The global XDF technology road shows come to Beijing next week. FPGA designers, system architects, data scientists and other technical leaders will gather December 3-4, 2019 at the China National Convention Center. Samtec technical experts and our partners will demonstrate some of the latest interconnect solutions affecting the Xilinx FPGA ecosystem. Samtec Interconnect on Xilinx Kits One of several demonstrations at XDF 2019 Asia shows the variety of Samtec interconnects supporting … [Read more...]
Samtec Releases New Interconnect Evaluation and Development Kits
FireFly™, ExaMAX® and Bulls Eye®, oh my! So, obviously, that is one geek's riff on a popular song in The Wizard of Oz. Dorothy, Scarecrow and Tinman were anxious for what came next on their walk down the Yellow Brick Road. Similarly, Samtec engineering customers are also anxious and excited. For what? Samtec's latest evaluation and development kits. Who wouldn't be anxious and excited? Samtec has released a number of new kits. These include solutions for RF test point systems, optical … [Read more...]
Removing Heat and Noise with Immersion Cooling
As we seek to go faster and faster in our systems, heat grows as does the noise from the cooling fans. It is because of this heat and noise, many companies are investigating or switching to liquid immersion cooling liquid immersion cooling options. Over the last few years, submersible cooling has started to gain some traction within the world of super computing. Chances are likely this trend will continue as computing requirements continue to grow, and data centers look for ways to lower … [Read more...]
We Have The Power!
I recently attended the Engineering Design Show in the UK, where one of the clear trends in evidence was the rise of power connectors for printed circuit boards (PCBs). The reasons are pretty clear. New technology is making ever-greater demands for more power in smaller spaces. The march towards miniaturisation continues, while at the same time users want systems with more and more functionality. Modern applications are placing demands for power delivery to the printed circuit board … [Read more...]
The Future of Content
The word “revolution” is very common in today’s world. Whether it’s a revolutionary new smartphone or a revolution in personal transport, it is a phrase that is used frequently. How many of these things are truly groundbreaking, or how many are victims of marketing is a matter of debate. Marketeers never lie, of course, but we have been known to squeeze the last ounce of truth from a story to make it appear more attractive! What cannot be denied is the staggering pace of … [Read more...]
Samtec to Demonstrate Next-Gen Architectures at AI Hardware Summit
"Artificial Intelligence" and "AI" are all the rage. From high frequency trading on Wall Street to improved drug development, AI affects more aspects of human lives daily. Many AI solutions harness the computing power of cloud connectivity, edge computing, data centers and HPC. There are any number of resources that discuss the best frameworks and learning algorithms. But what about the hardware? That is the goal of the AI Hardware Summit, being held September 17-18, 2019 at the Computer … [Read more...]
- « Previous Page
- 1
- …
- 5
- 6
- 7
- 8
- 9
- …
- 21
- Next Page »