This active product demonstration, of a connector system running at 56 Gbps PAM4, incorporates a Xilinx® Virtex® UltraScale+™ VCU 129 FPGA Evaluation Kit, and Samtec SI Evaluation boards with our new HSEC6 micro edge card connector. The HSEC6 connector is a .6 mm pitch, micro-pitch, high-speed edge card connector. Ralph Page, Systems Architect at Samtec, explains the set-up and discusses the performance of the system. Signal Path The Xilinx Virtex UltraScale+ FPGA is generating … [Read more...]
Our Most Popular Connectors For Medical Applications
When they hear the phrase connectors for medical applications, most electronics types think of some type of I/O interconnect to accommodate the cable interfaces on handheld devices. Push-pull cable products, circular cable assemblies, and wire-to-board solder cup headers and sockets usually come to mind. The medical electronics industry is one of Samtec’s largest customer segments. But unlike most other suppliers, Samtec’s most popular connectors for medical applications are all high data … [Read more...]
A New 56 Gbps PAM4 Connector Demonstration
Matt Burns, Technical Marketing Manager at Samtec, guides us through a demonstration that incorporates two high-performance connector sets. Samtec’s 56 Gbps PAM4 Product Demonstration Platform emulates real-world 56 Gbps PAM4 design challenges, which pairs bleeding edge silicon and interconnect solutions using real-world, optimized design practices. This platform showcases several of Samtec’s interconnect solutions, but this video focuses on the Samtec Bulls Eye® test point system, … [Read more...]
New Products, Technologies At electronica China
We all know the widespread havoc that Covid-19 wreaked in 2020. While the electronics industry in general, and connectors in particular, took an initial hit, the industry rebounded in the second half of 2020 and is rolling into 2021. Travel came to an almost stand-still in 2020, and the industry was quick to respond by converting in-person exhibitions, conferences, and shows to virtual events. In the U.S., many conferences are returning to live venues this summer. China has hosted several … [Read more...]
New High Speed Connector System: 56 Gbps PAM4 SI Evaluation Demonstration
Here's a live product demonstration of a new high speed connector system which achieves excellent SI results while running at 56 Gbps PAM4. Jean-Remy Bonnefoy, Systems Engineer at Samtec, explains how Samtec partnered with Credo for this active product demonstration. Credo’s mixed signal 56 Gbps PAM4 Bald Eagle 2 silicon generates two bi-directional channels of QPRBS-31 signal data at 56 Gbps PAM4. The differential signals travel through 2" of traces on a MEG4 PCB, to a Samtec … [Read more...]
New 56 Gbps PAM4 Connector SI Evaluation Kit Demo
Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration of a Samtec high-speed connector running at 56 Gbps PAM4, with incredible performance. It can also be run up to 28 Gbps NRZ. This active product demonstration uses a Xilinx® Virtex® UltraScale+ 56 Gbps PAM4 VCU 129 FPGA Evaluation Kit. The connector we’re evaluating is a Samtec HSEC8-DP. It’s a micro-pitch, high-speed edge card connector, for differential pair configurations. Check-out HSEC8-DV … [Read more...]
New COM-HPC Connectors Increase Density and Speed
The embedded world 2021 DIGITAL exhibition and conference recently concluded. A hot topic was the introduction of the PICMG® (PCI Industrial Computer Manufacturers Group) COM-HPC® standard. COM-HPC® The COM-HPC standard is intended to coexist with the existing COM Express® standard. COM-HPC supports two different module types – one for high performance computing and one for embedded computing. COM-HPC improves on what is achievable in COM Express today. It uses a new high-speed connector … [Read more...]
Impedance Corrected De-Embedding Verifies Connector Performance
We just started our next round of gEEk® spEEk online seminars. gEEk spEEk is a series of free online seminars covering a wide-range of SI-related topics, all commercial-free. Stefaan Sercu, Samtec Signal Integrity R&D Engineer, recently presented "Impedance Corrected De-Embedding," which discussed the advantages of impedance corrected de-embedding over standard 2X through de-embedding. I spoke to Stefaan about the main take-aways of his popular gEEk spEEk topic. Here's what he had to … [Read more...]
Industry Trends and Their Impact on RF Connectors
I’ve been reading year-end and upcoming year lists about the future trends affecting technology and electronics. Topics run the gamut from expanding technologies like 5G, AI, electric vehicles, and various realities (XR, VR, MR), to external pressures like increased government regulation and tech nationalism. Just about every list mentioned the ever-increasing need for bandwidth to accommodate cloud computing services, video conferencing, video streaming, e-commerce, etc. While these … [Read more...]
Break Out Region Design By Inspection
Samtec gEEk® spEEk is a series of free online seminars, covering a wide-range of topics, all commercial-free. gEEk spEEk allows engineers the opportunity to interact with signal integrity thought leaders and experts like DesignCon Engineer of the Year Istvan Novak, Scott McMorrow, and a number of other Samtec engineering leaders. Travis Ellis, a Signal Integrity Engineer at the Samtec Wilsonville (OR) Cable Facility, recently presented "Break Out Region Design By Inspection." The purpose of … [Read more...]
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