This video shows how Samtec Flyover® twinax high speed cable assemblies extend signal reach and density, allowing designers to achieve 112 Gbps PAM4 performance in AI system hardware architectures. Matt Burns, Technical Marketing Manager at Samtec, recorded this video during the AI Hardware Summit, at the Computer History Museum in Mountain View, CA. The Signal Path The demo is driven by a Xilinx® Versal™ Premium GTM transceiver, which allows vendors to position their network systems … [Read more...]
New PCIe® 6.0 PECFF Emulation Platform Hardware Demonstration
This video, from the AI Hardware Summit, shows a prototypical Gen-Z PECFF demonstration based on PCIe 6.0, at 64 GT/s. It shows PCB connectors and twinax cable systems, with performance capabilities eminently suitable for AI hardware applications. It’s a Gen-Z backplane with Gen-Z Add-In-Cards (AIC) with top card connectivity. This emulates industry standard AI Acceleration hardware platforms. It’s a configurable, scalable system featuring high-speed cable assemblies, high-speed edge … [Read more...]
New High Speed Cable System Enables 112 Gbps PAM4
A new high speed cable system, which enables 112 Gbps PAM4 signaling, can be used in mid-board, mid-board-to-front-panel, and panel-to-panel applications. This video from DesignCon 2021 shows a live product demonstration with a Samtec NovaRay®, Flyover® Cable system operating at 112 Gbps PAM4, as well as a Bulls Eye® high-performance test cable system. It’s all driven by a Xilinx ® Versal™ Premium GTM transceiver. The Versal Premium ACAP allows vendors to position their … [Read more...]
New High Data Rate 112 Gbps PAM4 Connector System
System architects and design engineers are interested in bleeding-edge performance. In this new 112 Gbps PAM4 product demonstration, Samtec marries an SI Evaluation Kit for the new AcceleRate®HP interconnect system with a Synopsys 112 Gbps PAM4 transceiver test chip. AcceleRate® HP is one of several Samtec connector systems rated at 112 Gbps PAM4, and it also provides outstanding design flexibility. The test set-up emulates real-world, high data rate applications by routing differential … [Read more...]
Samtec Sponsors AI Hardware Summit 2021
High-demand, standard IC supply chains continue to face bottlenecks. Additionally, new and emerging compute applications demand application-specific architectures with increased performance, low latency and less power. As a result, many Silicon Valley heavyweights are bringing chip-design in-house. The AI chipset and hardware industry seems ahead of this curve! AI system architects and IC designers have championed any number of original AI hardware solutions. For the past few years, the AI … [Read more...]
New PCIe 6.0 Live Demonstration
Check out this video from DesignCon 2021 showing a PCIe® Gen 6 live demonstration. It includes a new cutting-edge Synopsys chip, and two Samtec new high-performance connector systems. Ralph Page, Systems Architect at Samtec, walks us through the demo. He explains that the Samtec products are the new HSEC6 high-speed edge card connector, and the new 70 GHz Bulls Eye test point system. The Synopsys 6.0 PHY generates four 64 GT/s PAM4 differential signals. This is PCIe GEN 6 data … [Read more...]
Xilinx Kria™ Adaptive SoMs Feature Samtec AcceleRate® HD Slim Body Arrays
Rapidly-growing AI system capabilities are driving new product architectures that demand increased speeds, bandwidths, frequencies and densities. Scalability and configurability are a must. In embedded applications, many AI systems leverage the ease of design and economies of scale of systems-on-modules (SoMs). System-on-modules are an example of make or buy system design. A SoM includes the system compute engine (MCU, FPGA, GPU, etc.) as well as general support circuitry like DRAM, power and … [Read more...]
EDI CON Online 2021: Virtual Presentations from Samtec Technical Experts
The coronavirus pandemic accelerated digitization in many industries: travel, entertainment, business meetings and many more. The Samtec blog has disruption virtual tradeshows are having. On the other hand, there were virtual trades shows before COVID-10. EDI CON Online was one of the early pioneers in 2019 (a lifetime ago?). As with many technical events, attendees want access to key thought leaders. Thus, EDI CON Online was born. They came up with the perfect tagline: Where High Frequency … [Read more...]
Samtec and Mouser Electronic to Present PICMG COM-HPC® Webinar
Earlier this year, PICMG® announced the release of the new COM-HPC specification. COM-HPC (for “Computer on Module – High Performance Computing”) is an open standard for high performance computer modules targeting the embedded applications The development of COM-HPC exceeds the demand for high-speed performance in embedded computers. COM-HPC coexists with the COM Express® specification, but provides the scalability and enhanced performance for next-gen embedded system design. COM-HPC … [Read more...]
Knocking On The Door To 112 G PAM4
Channel rates have evolved from 28 Gbps NRZ to the current 56 Gbps PAM4, with 112 Gbps PAM4 in-development and knocking at the door. This live product demonstration shows the door is opening with a cutting-edge 112 G test chip and two new high-performance connector systems. It’s all driven by the Alphawave AlphaCORE 100 Long-Reach Multi-Standard SERDES. This is a high-performance, low-power, DSP-based PHY. The new connector products are the Samtec NovaRay® extreme density array … [Read more...]
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