Earlier this year, Samtec and CADENAS PARTsolutions collaborated on an advanced interactive catalog of 3D CAD models. The new tool assists engineers in defining and specifying any of Samtec's more than 1 trillion product models. Samtec's customers can dynamically configure, preview and download 2D/3D models in over 150 different formats. This adds speed, accuracy and flexibility to the connector selection and design process. Reducing Sample Times from 24 Hours to 24 … [Read more...]
Samtec FireFly™ Enables Cascading of Guzik DP 7000 Digital Processors
The computing demands of high-performance applications like HPC, machine learning and high-speed communications are driven by the CPU architectures championed by Moore's Law. As that has slowed, additional processing architectures such as GPUs, DSPs and FPGAs have become commonplace in data center acceleration applications. Discrete DSPs offer compelling solutions for many unique applications, but FPGAs offer massive DSP performance capabilities. This has become more … [Read more...]
November Web Updates to Samtec.com
November completed another solid month of web updates to Samtec.com. While there was no new application software released, we took this time to make a few key upgrades to some of our existing software to continue to enhance your user experience. Here are the major web updates for the month of November. New About Samtec Experience In this new "About Samtec" experience, we'll take you through our story, which started in 1976 with our founder Sam, and continues into today. Through the … [Read more...]
Samtec Releases New FMC+ Connector Set
Samtec proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications. The new ANSI/VITA 57.4-2016 standard extends the capabilities of ANSI/VITA 57.1-2010 in support of the increased number and data rates of multi-gigabit interfaces found in advanced FPGA architectures. Highlights of the new standard … [Read more...]
Samtec Helps with IIoT Security
Is seems hardly a day passes without "secure" data being hacked. Whether personal photos, enterprise data or factory floor controls, data security has become a higher focus for many. Avnet's new Trusted Platform Module (TPM) Security Peripheral Module for Zynq®-7000 All Programmable SoCs enables a root of trust for platform integrity, remote attestation, and cryptographic services required for IIoT applications. This new solution supports additional use cases such as … [Read more...]
More Samtec Updates from electronica 2016
Thursday is another day in the books here at electronica 2016. The Samtec booth continues to see high traffic from customers, vendors, partners and distributors. What is generating the most interest today? See below: High-Speed Edge Card Systems Designers and engineers here at electronica 2016 have a high degree of trust in tried-and-true interconnect solutions. Samtec's High-Speed Edge Card Systems offer several options providing flexibility in system design. Some key features … [Read more...]
Samtec Updates from electronica 2016
Electronica 2016 continues on Wednesday, November 9, 2016. The Samtec booth has been busy, and all of the exchanges with customers and partners are positive. What key areas are customers interested in? See below. Glass Core Technology Many visitors at Electronica are learning how Glass Core Technology can improve functionality in a much smaller footprint when compared to traditional packaging substrates. For more information on GCT, please download Samtec's Microelectronics … [Read more...]
Updates from electronica 2016
Electronica 2016 continues to unfurl this week in Munich. This year's show looks busier than ever! As we noted in our blog last week, Samtec is prominently featured at the event this year. If you are in Munich, please stop by Hall B3 Booth 407 to see the new technologies and products we are displaying this year. Glass Core Technology: Glass Core Technology (GCT) can achieve maximum functionality in a significantly smaller footprint with glass-based IC packages, modules, … [Read more...]
Lots To See At Electronica 2016
Electronica, in Munich, Germany, 8-11 November, is one of the leading trade fairs in the electronics industry. The best ways to describe it are simply huge, overwhelming (in a good way), and state-of-the-art. If you're visiting the show, we would love to see you at Hall 3, Booth 407. Samtec will be presenting its full line of interconnects, including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics, and IC-to-Board Systems. Probably … [Read more...]
October Web Updates to Samtec.com
If you're a regular user of Samtec.com, October was a great month for you! We brought you some exciting new design tools, a major homepage refresh, and a couple of huge new pieces of content for you to devour. Here are the major web updates for the month of October. Solutionator 2.0 Continues to Evolve In September, we brought you the all new release of our Solutionator tool, which is a parametric search tool designed to help you design your mated connector set in a minute or … [Read more...]
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