Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]
Samtec, FCI Sign Second Source Pact For ExaMAX
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax … [Read more...]
Samtec Releases 2,00 mm Pitch Discrete Wire IDC With Latching Option
Samtec recently released a 2,00 mm pitch discrete wire IDC system designed for a high reliability connection and ease of discrete wire termination in field applications. Available as IDC components only, this system eliminates the expense and need for special tooling, as well as any additional cost to purchase and inventory separate parts including bodies, contacts, etc. Check out the video demonstration of the wire termination with standard flat jaw pliers. The discrete wire IDC … [Read more...]
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