System designers and engineers constantly face design challenges to achieve higher data-rates in highly dense applications. A popular system-level design approach in many high-speed applications marries the configurability and high-speed performance of FPGAs with the advantages of fiber optics. Samtec's new 14 Gbps FireFly™ FMC Development Kit provides an easy connection between FPGAs and fiber optics. This new solution offers an easy-to-use evaluation and development … [Read more...]
Samtec to Attend STMicroelectronics Developers Conference 2017
Samtec proudly announces its participation this the ST Developers Conference 2017. This FREE one-day interactive summit will bring together experts in markets that are poised for rapid growth in the coming years: Smart Things for the IoT, Smart Driving, and Smart Home, City & Industry. Meet and learn from industry influencers presenting on a variety of topics while offering their perspectives on how these technologies will affect the future of product development. Presentations will offer … [Read more...]
June Web Updates for Samtec.com
With our last web update, we brought you a new way to export your data from our Solutionator parametric search tool, several updates to key support pages on the website, and our latest installment of product literature, our High Speed Board-to-Board Guide. This month, we're very excited to announce the release of a new way to search for content on Samtec.com, among a few other small improvements. Here is the summary of our major web updates for June 2017. Major Update to On-Site Search … [Read more...]
Samtec #1 In Bishop Europe Customer Service Survey
Samtec recently received the highest overall rating in the Bishop & Associates’ 2017 European Customer Survey of the Electronic Connector Industry. This is the 10th time Samtec has been rated as the #1 connector company in Europe. BTW, we have been ranked #1 in the North American Customer Service Survey 16 times. That’s not because we’re better in North America, it’s because they’ve ran the survey more times in the U.S. than Europe. BTW part two, the purpose of this blog is … [Read more...]
IIoT and Embedded Vision Drive Interconnect Growth
What is the next "smart" thing? Consumers always want the next big "it" thing. Component manufacturers constantly innovate new solutions to help the drive the next "hot" trend or killer application in the electronics industry. Whatever the next consumer trend may be, other markets and applications that receive less fanfare continue to grow and inspire semiconductor and interconnect innovation. The Industrial Internet of Things (IIoT) is driving connectivity in legacy factories, plants, … [Read more...]
Samtec Launches New Twinax FlyOver ChalkTalk
What have you done for me lately? No doubt all employees have at least mentally heard those words from their employers. "Here is the latest on the widget project," said everyone to their boss. Designers and engineers especially hear that question. The constant expectation for endless improvement and innovations remains a part of everyday life for engineers. Electrical engineers, signal integrity specialists, and PCB designers face a unique challenge. As bandwidth … [Read more...]
May Web Updates for Samtec.com
With our last web update, we brought you our new part number level technical specifications pages, a major upgrade to the way you research products on Samtec.com, as well as a streamlined sampling experience allowing you to place a sample for any full part number on just one screen. This time, we focused on creating new experiences on a number of our service-oriented pages, released the ability for you to export Solutionator parametric search results to Excel, and brought you a new High-Speed … [Read more...]
Samtec Releases High-Speed Board-to-Board Application Design Guide
If connector speed is a driver of industry growth, then Samtec is leading the pack. We offer not only the largest variety of high-speed board-to-board connectors, but we combine that with full engineering support, online tools and an unmatched service attitude to provide customers with a complete high-speed solution. To support this product line, a new High-Speed Board-to-Board Application Design Guide has been released. This brochure is a great overview of all that Samtec offers in … [Read more...]
Samtec to Attend STMicroelectronics’ Events
Data connectivity. Everybody wants it. Everybody asks for it. Samtec's innovative approach to product and solution development led to an investment in nMode Solutions and Triton Microtechnologies in 2016. This strategic acquisition expanded Samtec's core capabilities and diversified our product offerings for data connectivity and IoT applications. Samtec will provide details into our product roadmap of wireless modules and expanded IoT capabilities at several … [Read more...]
Samtec Microelectronics at ECTC 2017
Samtec will be attending ECTC 2017 from May 30 to June 2 at Booth 313/315. We will be featuring several IC packaging solutions such as flip chip, ultra high density micro interposers, as well as offering full system support. In addition, we will also be showcasing our glass core technology (GCT). ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic … [Read more...]
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