Samtec’s Z-Ray® one piece arrays are ultra-low profile, high density and highly customizable. These compression contact arrays are used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. The new 1.00 mm pitch arrays (ZA1 Series) expand the Z-Ray® interposers product line … [Read more...]
Direct Connect High Speed Press Fit Cable Assembly
Our new DCC Series -- direct connect cable system – is a cost-effective high speed cable solution that supports and surpasses PCIe® Gen3 speeds at 2 meters cable length. The DCC is rugged. High retention press fit pins attach directly to the PCB, eliminating the cost of the mating connector. Fortunately an extraction tool is available. The assembly also has an over-molded strain relief. The connector saves space. First, it is low profile, only 3,00 mm tall. Second, it also saves space … [Read more...]
Come to See Samtec At New Tech, Israel
Please visit Samtec at the New Tech Exhibition - 2015, on 19 and 20 of May. We are at booth #40. You can see several of our major new products, including: ExaMAX® backplane systemsZ-Ray™ high density, low profile interposersAdditions to the SEARAY™ line of high density, open-pin field arraysFireFly™ future-proof, Micro Flyover™ system The New–Tech 2015 Exhibition is the largest and major exhibition of the Hi–Tech & Electronics in Israel. More than 140 companies, who lead these … [Read more...]
SEARAY™ Solder Joints Are Class 3, IPC-A-610
Samtec SEARAY™ SEAM, SEAF Series solder joints are now classified as Class 3 in the IPC-A-610 Rev F Standard. Class 3 is for high performance/harsh environment electronic products. This includes products where continual high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, the end-use environment may be extremely harsh, and the equipment must function when required. Common examples include flight controls on an aircraft and life support or other critical … [Read more...]
Samtec Joins IRT Nanoelec Silicon Photonics Program
Samtec is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using Silicon Photonics technology for addressing Data Centers and High Performance Computing applications. Officials from all parties expressed their enthusiasm. “We are thrilled with the opportunity to join the Silicon Photonics Program of the … [Read more...]
Be Sure to Visit Samtec at OFC
We hope you can visit us at OFC, March 24-26, at the Los Angeles Convention Center. Our booth (#1849) will have two high-speed product demonstrations and onsite experts to bring you up-to-speed about several new Samtec products. Our physical product demonstrations include a FireFly™ 12 channel optical Micro Flyover™ System operating at 28 Gbps/channel (336 Gbps aggregate), and Samtec ExaMAX® backplane systems at 28 Gbps/channel (1 Tbps/connector pair) and 40 Gbps/channel (1.25 Tbps/connector … [Read more...]
Samtec Announces Hirose as Second Source for FireFly™ Micro Flyover System™
Samtec, Inc. is pleased to announce an agreement with Hirose Electric USA, Inc. as a second source for Samtec’s FireFly™ Micro Flyover System™. As a certified independent second source, Hirose can now provide its customers a future-proof inside-the-box system, as well as additional support to Samtec’s customers who use FireFly™ for current and future applications. Adam Linderman, SI Product Manager for Samtec said, “Having a dual source for FireFly™ further demonstrates Samtec’s dedication to … [Read more...]
Another DesignCon 2015 Paper – Causality Demystified (Best Paper Award Finalist)
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. One paper, "Causality Demystified," was a DesignCon 2015 Best Paper Award Finalist. Download the Causality Demystified paper from DesignCon 2015 Here's a summary if you prefer to check it out first: The quality of time domain simulation results depends on the quality of the Sparameter models used. Causality is shown to be an important parameter limiting the usefulness of a model. In this paper we demonstrate … [Read more...]
28 Gbps Backplane Demo Using Virtex UltraScale FPGAs and Samtec Backplane System
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]
