Connectors For High Cycle, Harsh Environment Applications Let’s have a show of hands. If you specify board level interconnects, how many of you require your interconnect system to be rated at 2,500 cycles or more? Most board level interconnect applications require far less than 100 cycles over their lifetime, but obviously there are exceptions. Those exceptions range from 150 cycles to 2,500 to 10,000. If your application falls into the latter category, you should know about Samtec … [Read more...]
One of A Kind – One Piece Board-to-Board Interconnects
Board-to-board interconnect systems come in all shapes and sizes. Obviously, selecting the right interconnect set for your application is paramount to success. Designers need to choose products that meet their size, shape, mechanical, and electrical requirements. Two-piece interconnect sets, with a terminal that interfaces with a socket/receptacle, are the most common application. Rugged For designers who need micro pitch interconnects in a rugged, high shock and vibration … [Read more...]
Sweet Sixteen – Samtec Ranked #1 in Bishop Customer Survey
Samtec Ranked #1 in Bishop Customer Survey for 16th Time Samtec recently received the highest overall rating in the Bishop & Associates’ U.S. Customer Survey of the Electronic Connector Industry. This is the 16th time Samtec has been rated as the #1 connector company in North America. Samtec received the highest overall ranking in the survey. Samtec was ranked #1 by engineers, OEMs, CEM/EMS, and distributors. Other notable results include: #1 product quality#1 price … [Read more...]
Board Stacking Interconnects For Unusual Applications
Samtec has more ways to connect two or more boards than any other interconnect provider. This blog discusses board stacking interconnects that are a little different than your standard mezzanine configuration, but offer solutions when you have design constraints that can be difficult to work around. Connect Three (or more) Boards A board stacking strategy employed by many Samtec customers is “pass-through.” A common pass-through application is connecting three pcbs (or more) … [Read more...]
Selecting The Right Contact For Your Board-to-Board Interconnect System
Many Samtec blogs discuss bleeding edge new technologies, new products, or provide guidelines on optimizing system performance. Having said that, one of our biggest selling product lines is standard pitch (2.54, 2.00, 1.27 mm) board-to-board interconnects. These are not as sexy as using an ultra-high-density interconnect with PAM4 to achieve 56 Gbps serial channels, but they look mighty appealing if your job is to identify and design-in reliable board-to-board interconnect systems. Samtec has … [Read more...]
Amphenol and Samtec Sign License Agreement for Backplane Interconnect Products
Licensing agreement brings electronics equipment manufacturers a reliable new supplier of Amphenol’s high performance backplane connectors Nashua, NH, May, 2016 -- Amphenol, the leading provider of high performance backplane interconnect systems, and Samtec, Inc., a leader in interconnect systems and signal integrity consulting, have entered into license agreements for several backplane connector families. Under the agreements, Amphenol will license its intellectual property and detailed … [Read more...]
Samtec Announces Acquisition Of nMode Solutions and Triton Microtechnologies
Advanced Technologies Augment Samtec Technology Roadmap for 3-D Packaging, Sensor Modules, and Wireless Connectivity New Albany, IN, May 31, 2016 – Samtec, Inc., a leading provider of high bandwidth and micro-pitch interconnect systems, announced today the acquisition of nMode Solutions, of Oro Valley, Arizona. “The acquisitions of nMode Solutions and their subsidiary, Triton Microtechnologies, is a critical next step in Samtec’s technology roadmap. This furthers our … [Read more...]
Guidelines For Paste-In-Hole Reflow Processing
Many Samtec customers employ Paste-In-Hole (PIH) processing. Very simply put, this is the process of screening solder paste into and around plated through-holes on a pcb, and placing the leads of through-hole components -- like connectors -- in these prepared through-holes. The boards are run through a reflow soldering process, thus terminating both through-hole and SMT components in one reflow process. Advantages of Paste-In-Hole Technology Can any connector be used in PIH? To be a … [Read more...]
Eric Bogatin’s Three Predictions On The State Of Signal Integrity
Signal Integrity expert Eric Bogatin recently shared three predictions on the state of signal integrity. Based on his discussions at DesignCon 2016 and thereafter, Eric has three predictions about major changes ahead for high speed serial link systems. The first is the rollout of 28 Gbps systems will be slower than expected. Eric explains that the semiconductor companies producing the CMOS devices – ASIC, FPGA or custom – are doing fine producing the silicon with acceptable performance at 28 … [Read more...]
High Speed Signal Transfer Rates At 28 Gbps (OFC 2016)
In this video, Kevin Burt, of the Samtec Optical Group, discusses another demonstration from OFC 2016. This is a system level demonstration of high speed signal transfer rates at 28Gbps, FireFly™ high speed optical links at 28 Gbps, and signal quality performance of ExaMAX® backplane connector. Kevin discusses the advantages of the industry's first Flyover QSFP28 (FQSFP) System. This approach removes signals from their traditional pathways—copper traces … [Read more...]
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