If you're reading this, chances are you work with board level interconnects and are familiar with design and processing issues that affect them. If your job doesn’t require you to work with connectors, but you’re still reading this, then you are probably messed up and need some type of professional help. Assuming you're in the first group, check out the list below. This is from Phil Eckert, Samtec’s Customer Quality Engineering Manager. Phil’s career includes connector design, quality … [Read more...]
New 1.00 mm Pitch Ultra Low Profile, Ultra High Density Interposer
Samtec’s Z-Ray® one piece arrays are ultra-low profile, high density and highly customizable. These compression contact arrays are used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. The new 1.00 mm pitch arrays (ZA1 Series) expand the Z-Ray® interposers product line … [Read more...]
Direct Connect High Speed Press Fit Cable Assembly
Our new DCC Series -- direct connect cable system – is a cost-effective high speed cable solution that supports and surpasses PCIe® Gen3 speeds at 2 meters cable length. The DCC is rugged. High retention press fit pins attach directly to the PCB, eliminating the cost of the mating connector. Fortunately an extraction tool is available. The assembly also has an over-molded strain relief. The connector saves space. First, it is low profile, only 3,00 mm tall. Second, it also saves space … [Read more...]
Solder Balls On High Density Arrays Self-Align During Reflow
Check out this video of how Samtec’s ZA8 Series, a high density grid array interposer, self-aligns during reflow. We are frequently asked about the placement and processing of high density arrays. As shown above, the self-centering characteristics of the connector combined with the surface tension of the solder on the board draws the solder ball / interposer contact to the center of the pad. Of course you also need to closely follow Samtec’s recommended footprint and stencil designs and … [Read more...]
Come to See Samtec At New Tech, Israel
Please visit Samtec at the New Tech Exhibition - 2015, on 19 and 20 of May. We are at booth #40. You can see several of our major new products, including: ExaMAX® backplane systemsZ-Ray™ high density, low profile interposersAdditions to the SEARAY™ line of high density, open-pin field arraysFireFly™ future-proof, Micro Flyover™ system The New–Tech 2015 Exhibition is the largest and major exhibition of the Hi–Tech & Electronics in Israel. More than 140 companies, who lead these … [Read more...]
High Density Arrays Offer Maximum Design Flexibility
Check out our new SEARAY™ video for a quick overview of why it’s one of the fastest-growing, most robust interconnect systems in the industry. Here’s why: high density (up to 500 I/Os)high speed (28+ Gbps)routing and grounding flexibility (open pin field design for differential pairs, single ended designs, and power)Differential Vias™ PCB routing for high density, DP applicationslow profile (down to 4mm stack)ultra-high density space saving designs (0.80 mm pitch saves 50% board space vs. … [Read more...]
SEARAY™ Solder Joints Are Class 3, IPC-A-610
Samtec SEARAY™ SEAM, SEAF Series solder joints are now classified as Class 3 in the IPC-A-610 Rev F Standard. Class 3 is for high performance/harsh environment electronic products. This includes products where continual high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, the end-use environment may be extremely harsh, and the equipment must function when required. Common examples include flight controls on an aircraft and life support or other critical … [Read more...]
Samtec Joins IRT Nanoelec Silicon Photonics Program
Samtec is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using Silicon Photonics technology for addressing Data Centers and High Performance Computing applications. Officials from all parties expressed their enthusiasm. “We are thrilled with the opportunity to join the Silicon Photonics Program of the … [Read more...]
Z-Ray® Ultra Low Profile, High Density Interposers Provide Design Flexibility
Samtec’s Z-Ray® one piece arrays are ultra-low profile, high density and highly customizable compression contact arrays used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. These 0.80 mm pitch arrays (ZA8 Series) are available with a choice of dual compression contacts or single … [Read more...]
Samtec 12 Channel, 28G FireFly Demo – An Interview With Kevin Burt
Check out this video from OFC, with Samtec's Kevin Burt discussing the demo of our FireFly™ 12 channel optical Micro Flyover™ System operating at 28 Gbps/channel (336 Gbps aggregate). Kevin also discusses the benefits of mid-board optics. … [Read more...]
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