DesignCon 2017 is right around the corner. As in past years, Samtec will have a large presence throughout the event. Our SI experts will present technical papers. Our application engineers will demonstrate new system-level solutions. Our product experts will discuss various new and emerging products that will be released throughout 2017. And if I'm there I'll be at the food court ... TECHNICAL PAPER Jim Nadolny, Samtec’s Director of Signal Integrity, will … [Read more...]
Micro, High Density, High Speed Razor Beam™ System
Samtec Razor Beam™ products are micro pitch, high density, high speed interconnect systems. Razor Beam products save space on the X, Y, and Z axes. In other words they are very fine pitch, they have slim body designs, and they are low profile. RAZOR BEAM While Samtec Razor Beam interconnects are micro pitch – on 0.50, 0.635, and 0.80 mm pitch – they are rugged. Mating contacts feature undercut retention notches that produce an audible click when the contacts engage. … [Read more...]
A New High Speed Connector Rating That Accounts For The Entire System
Designers periodically ask us for a "general bandwidth performance rating" to compare two or more interconnect systems. Of course numerous variables affect the signal integrity performance of an interconnect, so a one-size-fits-all approximation definitely does not fit all. Now, a new approach allows system signal integrity engineers to compare relative performance of connectors and cable assemblies while factoring in noise contributions from and interactions with other parts of the … [Read more...]
Lots To See At Electronica 2016
Electronica, in Munich, Germany, 8-11 November, is one of the leading trade fairs in the electronics industry. The best ways to describe it are simply huge, overwhelming (in a good way), and state-of-the-art. If you're visiting the show, we would love to see you at Hall 3, Booth 407. Samtec will be presenting its full line of interconnects, including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics, and IC-to-Board Systems. Probably … [Read more...]
Best Practices For Connector Models
Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website. Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies. Heidi and Jim cover a lot of topics, from S-parameter … [Read more...]
Bend There, Done That (Quick, Inexpensive Custom Interconnects)
Most designers shy away from using modified or custom interconnects, mostly due to concerns about price, availability, and sourcing. But there are times when you can’t find a standard product that works in your design, and you have to consider using a modified or custom interconnect. Samtec has the ability and willingness to design and build modified and custom interconnects, from simple to complex. Samtec’s team of dedicated ASP (Application Specific Product) engineers and … [Read more...]
Solving Signal Integrity Problems At Very High Data Rates
Our friends at EDN recently published Solving Signal Integrity Problems At Very High Data Rates. The article - written by Lee Ritchey and Kella Knack from Speeding Edge and Teraspeed's own Scott McMorrow - discusses the challenges of achieving high data rates given parasitics in PCBs. It presents a novel, alternative design approach to the problem. To elaborate a bit ... Advances in semiconductor technology are making it possible to connect components in … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 2)
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve's workshop presentation. Here is the link to the first blog, with the first half of the video. With autonomous vehicles currently being … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 1)
The auto industry is poised for more change in the next five to ten years than it’s seen in the past 50. That quote, from Mary Barra, CEO of General Motors, illustrates the driving force (no pun intended) for increasingly complex electronics in vehicles. Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, … [Read more...]
Popular Design Modifications of Discrete Wire Cable Assemblies
Samtec's new generation of micro pitch discrete wire cable assemblies – 0.80, 1.00, and 1.27 mm pitch – meet the challenge of electronics devices getting smaller and denser. Speaking of discrete wire, did I mention that 36% of Samtec discrete wire systems are modified and custom products? What type of modified products are designers asking for, and why? Glad you asked! Below is a summary of some of our most frequently requested discrete wire cable assemblies. All of … [Read more...]
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