Samtec recently received the highest overall rating in the Bishop & Associates’ 2017 European Customer Survey of the Electronic Connector Industry. This is the 10th time Samtec has been rated as the #1 connector company in Europe. BTW, we have been ranked #1 in the North American Customer Service Survey 16 times. That’s not because we’re better in North America, it’s because they’ve ran the survey more times in the U.S. than Europe. BTW part two, the purpose of this blog is … [Read more...]
SEARAY High Speed, High Density Connector
SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. Design Flexibility SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which means we don’t have pins dedicated as signal or ground. Designers can specify some pins for single-ended signals, some can be routed as differential pairs, some ground, and some for power, all on the same … [Read more...]
Micro, Rugged IDC Cable Assemblies
Samtec’s FFSD, FFMD Series are micro-pitch, high reliability, high cycle IDC cable assemblies. TIGER EYE™ CONTACT The connector systems incorporate the Tiger Eye™ contact. Tiger Eye is a rugged contact for micro pitch interconnects; it is ideal for high reliability and high mating cycle applications. Tiger Eye is reliable because it is a multi-finger design. For example, the contact on the FFSD cable assembly has four points of contact. The contact mating surface is on the flat, … [Read more...]
GCT For Miniature Substrate Packaging
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias that are metalized and hermetically sealed. The TGVs are linked via a unique thin film Redistribution Layer (RDL) process to create custom … [Read more...]
Samtec Interconnects In Military, Aerospace
Interconnects for the military/aerospace industry are used in a variety of applications, including communication and navigation equipment, radar, airborne, marine and space guidance control, and electronic warfare, to name a few. While Samtec products are used in commercial applications like the industrial, datacom, telecom, computer and peripheral, instrumentation, medical, and automotive industries, aerospace and military account for a significant portion of our total sales. This is … [Read more...]
High Speed Mezzanine Connectors With Integral Ground Planes
Samtec Q Strip® connectors are designed for high speed board-to-board applications where signal integrity is essential. The Q Strip connectors have surface mount signal contacts as well as a surface mount ground plane between the two rows of signals for improved electrical performance. Q Strip products are available on three different pitches: 0.50 mm pitch (QTH, QSH Series)0.80 mm pitch (QTE, QSE Series)0.635 mm pitch (QTS, QSS Series) By the way, the 0.50 mm pitch versions are … [Read more...]
Microelectronics In Biomedical
Steve "Groot" Groothuis, CTO of Samtec Microelectronics, recently presented "Biomedical Solutions: Successfully Integrating New Chips, Packages, and Modules" at BIOMEDevice in Boston. The presentation included an overview of: How Samtec microelectronics are incorporated into medical devices and diagnostic equipmentGlass Core Technology (GCT), a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias (TGVs) that are … [Read more...]
12G SDI Signal Processing and Transmission Demonstration (NAB 2017)
Chris Shelly, Samtec's RF/SI Modeling Engineer, walks us through another 12G SDI product demonstration from NAB 2017. This demonstration showcases the Samtec BNC Edge Mount connector used in the Fidus® Gearbox+™ and the Phabrix® QX UHDTV 12G SDI generator/analyzer. This demonstration not only showcases the signal processing capabilities of both of these products, it also highlights the transmission of those signals through several other Samtec 75 ohm PCB connectors. Chris walks us … [Read more...]
Flexing Our Board Stacking Muscles
Many Samtec blogs discuss bleeding edge technologies, new products, or provide guidelines and tips on optimizing system performance. Having said that, our biggest selling product line is standard pitch (2.54, 2.00, 1.27 mm), two-piece board-to-board interconnects. These are not as sexy as using an ultra-high-density interconnect with PAM4 to achieve 56 Gbps serial channels, but they look mighty appealing if your job is to identify and design-in reliable board-to-board interconnect … [Read more...]
Samtec 12G SDI Connectors Performance Demonstration at NAB 2017
Chris Shelly, Samtec's RF/SI Modeling Engineer, walks us through one of two 12G SDI live demonstrations at NAB 2017. This product demonstration showcases live Return Loss testing of different connectors series per the SMPTE ST-2082-1 12G SDI single channel 4K /UHD requirements. The demonstration highlights the custom launch design that successfully allow even the more challenging right angle connector configurations to perform at this high level. With PCB terminated RF … [Read more...]
- « Previous Page
- 1
- …
- 28
- 29
- 30
- 31
- 32
- …
- 40
- Next Page »