OFC 2017, The Optical Networking and Communication Conference & Exhibition, is a global forum and exhibition for optical communications and networking possibilities. Samtec will showcase the latest FireFly™ Optical Cable Systems, including new PCIe® Over Fiber, extended temperature, and low-profile designs. We will also discuss how the Samtec FireFly™ connector was adopted by the Consortium for On Board Optics, and we will run four product demonstrations, among others. OFC … [Read more...]
Search Results for: VITA 57
Samtec Demos Flyover QSFP In Xilinx VCU118 Demonstration Board At DesignCon 2017
One of several demonstrations at DesignCon 2017 shows the variety of Samtec interconnects supporting the Xilinx® Virtex® UltraScale+ FPGA VCU118 Development Kit. Included in the kit is an FMC+ Active Loopback Card, which carries Samtec's direct attach Flyover™ QSFP28. In the Flyover QSFP28 demonstration, four GT 28 Gbps transceiver signals are generated by the FPGA and launched mid-board from the FireFly™ connector system. These 28 Gbps signals “flyover” the board … [Read more...]
Our 11 Most Popular Blog Posts of 2016
2016 was an exciting year for Samtec, with several major product releases, a few major software and website releases, and a couple of significant company acquisitions. We've done our best to detail all of it and more on The Samtec Blog, along with several pieces of content to help you solve your design problems along the way. Here are our top 11 most popular articles of 2016. Enjoy! Samtec Announces Acquisition of nMode Solutions and Triton Microtechnologies In May of 2016, Samtec … [Read more...]
Samtec Releases New FMC+ Connector Set
Samtec proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications. The new ANSI/VITA 57.4-2016 standard extends the capabilities of ANSI/VITA 57.1-2010 in support of the increased number and data rates of multi-gigabit interfaces found in advanced FPGA architectures. Highlights of the new standard … [Read more...]
Samtec SEARAY™ High Density Arrays Continue to Expand
Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines. Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility to support many high-speed board-to-board applications. SEARAY™ High-Density Open Pin Field Array's many features and … [Read more...]
Samtec Exhibits at OFC ’16 in Anaheim, CA
One of the biggest tradeshows in the optical world is OFC. At this year’s event in Anaheim, Samtec will be exhibiting a variety of mid-board and panel-mount optical systems. Samtec’s optical and signal integrity expertise enables systems designs with maximum density, minimal cost and performance optimization, while offering a path to 56 Gbps and beyond. Of several products being featured at OFC this year, the FireFly™ Micro FlyOver System™, which enables chip-to-chip, … [Read more...]
OFC Show
OFC is the largest global conference and exhibition for optical communications and networking professionals. OFC offers key networking and partnering opportunities, and provides insights and inspiration on the major trends and technology advances affecting the industry. Visit Samtec at OFC at booth # 2367 to see a system level demonstration of high speed signal transfer rates at 28Gbps, FireFly™ high speed optical links at 28 Gbps, and signal quality performance of ExaMAX® backplane … [Read more...]
High Density Arrays Offer Maximum Design Flexibility
Check out our new SEARAY™ video for a quick overview of why it’s one of the fastest-growing, most robust interconnect systems in the industry. Here’s why: high density (up to 500 I/Os)high speed (28+ Gbps)routing and grounding flexibility (open pin field design for differential pairs, single ended designs, and power)Differential Vias™ PCB routing for high density, DP applicationslow profile (down to 4mm stack)ultra-high density space saving designs (0.80 mm pitch saves 50% board space vs. … [Read more...]
12G SDI FPGA Mezzanine Card Targeting Xilinx Platforms
Fidus Electronic Development and inrevium has introduced the TB-FMCH-12GSDI, a 6G/12G SDI FPGA Mezzanine Card (FMC) targeting Xilinx platforms. Fidus uses six, 75 ohm Samtec HDBNC connectors, as well as SEARAY™ interconnect systems as specified in the VITA 57 standard. The six HDBNC connectors support: 1x 12G SDI input, 1x 12G SDI output, 3x 12G In or Out, and 1x Video Sync input. With onboard Sync separator and Clock Generator, the FMC can provide all necessary inputs to the FPGA. The FMC is … [Read more...]
Connectivity for Artificial Intelligence
Every element of modern life has been impacted by the rise of computing and the semiconductors that power it, but there is no aspect of computing that has caught the public imagination more that the rise of artificial intelligence (AI) and machine learning (ML). Although AI has been with us for some time, recent advances in technology has placed the power of these technologies into the hands of everyday users. Beyond the public arena, AI is enabling innovation in almost all sectors of … [Read more...]
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