A new high speed cable system, which enables 112 Gbps PAM4 signaling, can be used in mid-board, mid-board-to-front-panel, and panel-to-panel applications. This video from DesignCon 2021 shows a live product demonstration with a Samtec NovaRay®, Flyover® Cable system operating at 112 Gbps PAM4, as well as a Bulls Eye® high-performance test cable system. It’s all driven by a Xilinx ® Versal™ Premium GTM transceiver. The Versal Premium ACAP allows vendors to position their … [Read more...]
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DesignCon 2021
Samtec is prepared for the fast-approaching technical renaissance with innovative Silicon-to-Silicon solutions that exceed standard connectivity demands. New architectures will require massive increases in transmission speeds, bandwidths, frequencies and densities. Samtec is addressing these challenges with a broad line of signal integrity optimized, high-performance interconnect and technology solutions, along with the highest level of expertise in the industry. Below are the details from … [Read more...]
Industry Trends and Their Impact on RF Connectors
I’ve been reading year-end and upcoming year lists about the future trends affecting technology and electronics. Topics run the gamut from expanding technologies like 5G, AI, electric vehicles, and various realities (XR, VR, MR), to external pressures like increased government regulation and tech nationalism. Just about every list mentioned the ever-increasing need for bandwidth to accommodate cloud computing services, video conferencing, video streaming, e-commerce, etc. While these … [Read more...]
FireFly Technology Enables Bandwidth in CERN LHC
UCLA's Maxx Tepper gives us a brief overview of the Ocean High-Throughput processor to be used in the upgrade of the real-time event selection system of the CMS experiment at the CERN LHC (Large Hadron Collider). The board incorporates Samtec FireFly™ optical cable assemblies. The project is part of the research program of the UCLA Physics and Astronomy Department, supported by the National Science Foundation. The board receives data from 500 detectors and reconstructs particle … [Read more...]
A Performance Comparison of Air-Cooled vs. Immersion Cooled Connector Systems
As computing power continues to increase, air cooled systems cannot meet current thermal requirements for HPC hardware systems. Power consumption, space and performance must all be considered during system design. Immersion cooling is a fast-growing solution to economically combat system heat, noise, power consumption and compute density. Samtec’s Brian Niehoff presented “Thermal Management of HPC Hardware Architecture via Immersion Cooling” at the Exhibitor Forum at SC20. Brian’s … [Read more...]
A New High Performance Test System – 70 GHz
Samtec Bulls Eye® test point systems are ideal for high performance test applications because of their compression interfaces, small footprint, and high cycle count capabilities. Bulls Eye is now available in a new 70 GHz design, which joins the existing 50, 40, and 20 GHz systems. The Bulls Eye grid design and smaller footprint enable smaller evaluation boards and shorter trace lengths. The high-density array design saves significant PCB space compared to traditional test points. … [Read more...]
A Cable Backplane Solution For 112 Gbps PAM4 Architecture
Scott McMorrow, CTO, Samtec Signal Integrity Group, walks us through a live demonstration of a cable backplane and mid-board cable system, both utilizing Samtec Flyover® . Samtec Flyover is most commonly used in mid-board applications, with the cable assembly connector placed close to the chip and direct the signal to the front panel through the cable. Cable Backplane and Mid-Board Applications Flyover also allows designers to go from one board to another as a flexible backplane … [Read more...]
DesignCon 2020: A Technical Renaissance
Samtec loves DesignCon. It’s an opportunity to present our new signal integrity optimized, high-performance interconnect and technology solutions, along with the highest level of support and expertise in the industry. To learn more about these products and solutions, stop by the Samtec Booth, #737. I’m trying to be objective here, but if you’re in California the last week of January (or if you're in any of the other 50 states (or Canada or Mexico)), you need to stop by booth #737 at … [Read more...]
Full-Scale Immersion Cooling of Optical Transceiver, PCBs
While air cooling is still a commonly used method to cool data centers, the industry is seeing HPC, AI, and scientific computing market leaders investigating either conduction cooling, or full-scale immersion cooling, for their next generation designs. In this video from SuperComputing 2019, Arlon Martin and the Samtec Optical Group are demonstrating the latest developments in full-scale immersion cooling. Using Samtec Flyover® technology and FireFly™ optical modules as an … [Read more...]
AI, 5G and Automotive – Dispatches from XDF Silicon Valley
The FPGA (or ACAP) universe gathered at the San Jose Fairmount last week during the Xilinx Developer Forum. Engineers, data scientists, analysts, distributors, alliance partners and more came to learn about the latest hardware, software and system level solutions from Xilinx. Xilinx CEO Victor Peng set the theme of the event with his keynote. Xilinx (and thier partner's) business strategies revolve around three key growth drivers: Data Center, 5G and Automotive. The Samtec team … [Read more...]
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