Scott McMorrow, CTO, Samtec Signal Integrity Group, walks us through a live demonstration of a cable backplane and mid-board cable system, both utilizing Samtec Flyover® . Samtec Flyover is most commonly used in mid-board applications, with the cable assembly connector placed close to the chip and direct the signal to the front panel through the cable. Cable Backplane and Mid-Board Applications Flyover also allows designers to go from one board to another as a flexible backplane … [Read more...]
Search Results for: Scott McMorrow
Optimizing 112 Gbps PAM4 Interconnect Design Leveraging ANSYS® HFSS™
It seems like everyone is thinking about the global coronavirus scare, and rightfully so. Workers, students and those most as risk are staying home. What are people doing at home? They are probably binge-watching their favorite video streaming service. It appears not even COVID-19 can slow consumers' insatiable demand for data. This puts constant pressure on internet providers, equipment vendors and components suppliers to develop higher-performance networks. Samtec is a global leader in … [Read more...]
DesignCon 2020: A Technical Renaissance
Samtec loves DesignCon. It’s an opportunity to present our new signal integrity optimized, high-performance interconnect and technology solutions, along with the highest level of support and expertise in the industry. To learn more about these products and solutions, stop by the Samtec Booth, #737. I’m trying to be objective here, but if you’re in California the last week of January (or if you're in any of the other 50 states (or Canada or Mexico)), you need to stop by booth #737 at … [Read more...]
DesignCon 2020
Samtec's Istvan Novak has been named DesignCon Engineer of the Year. Congratulations, Istvan! Istvan is a Principle Signal and Power Integrity Engineer at Samtec, working on advanced signal and power integrity designs. He introduced the industry's first 25 um power-ground laminates for large rigid computer boards and worked with component vendors to create a series of low-inductance and controlled-ESR bypass capacitors. DesignCon 2020 Best Paper Award Samtec proudly … [Read more...]
Samtec Technical Experts to Present at EDI CON ONLINE
"Where high frequency meets high speed," says the tag line of past EDI CON USA events. What exactly is EDI CON? Technical specialists from across the RF, microwave, EMC/EMI, high-speed digital design and system integrator spectrum met annually. Why? For networking, training and learning opportunities naturally. What about 2019? In a new twist, this event is going digital. EDI CON ONLINE replaces the in person events with virtual, real-time training. It has been specifically targeted … [Read more...]
EDI CON ONLINE
EDI CON Online brings much needed technical training and information directly to engineers’ desktops and mobile devices.Free, real-time training with easy registration and access. Featuring 3 days of:• Keynotes• Technical Sessions• Workshops & Product DemonstrationsCovering topics in RF, Microwave, Signal Integrity, Power Integrity, and EMC/EMI.Attendees select their sessions for the online event in a single sign-on registration portal.Attendees participate live (including Q&A) or watch … [Read more...]
112 Gbps PAM4 Backplane Cable: Higher Performance, Less PCB Complexity
In this video from DesignCon 2019, Scott McMorrow walks us through a live demonstration showing how NovaRay® Cable assemblies offer extreme density while enabling 112 Gbps PAM4 performance. In combination with an ExaMAX® Backplane Cable assembly, the traditional backplane architecture is retained, but with higher performance targets and lower PCB complexity. Samtec Flyover® systems can help extend signal reach and density to achieve next gen speeds by routing signals via Eye Speed® ultra-low … [Read more...]
DesignCon 2019
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including demonstrations of our state-of-the-art 56 Gbps PAM4 Active Product Demonstrator featuring several new products: AcceleRate® mezzanine, ExaMAX® backplane, and Eye Speed® ultra low skew twinax in AcceleRate® and Double Density Samtec Flyover™ QSFP28 cable assemblies. Other spotlight products include AcceleRate® 56 Gbps PAM4 multi-row interconnects, 112 Gbps PAM4 NovaRay™ high-density arrays … [Read more...]
DesignCon 2018 Parting Thoughts – How real is 112 Gbps PAM4?
DesignCon 2018 has passed. For those involved from the high-speed communications and semiconductor communities, everyone needs time to catch their breath a bit before planning for the rest of 2018. Why? DesignCon always offers exposure to the latest state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities. One question was on the minds of many: How real is 112 Gbps PAM4? The number of demos and presentation at DesignCon prove the … [Read more...]
Samtec’s DesignCon 2018 Conference Schedule
DesignCon 2018, which is a big deal for Samtec, is a few weeks away. Our high-speed technologies for Silicon-to-Silicon optimization will be on full display and our product experts will show new products that are just released, or will be released in 2018. Our application engineers will demonstrate new system-level solutions, and our SI experts will present technical papers. In the next few weeks we'll write about all of these products, demos, events, and presentations. To help you … [Read more...]