Samtec Showcases Latest Interconnect Solutions at embedded world 2021 DIGITAL
New PICMG COM-HPC®-aligned Connectors Featured
EMBEDDED. INTELLIGENT. SYSTEMS.
embedded world 2021 DIGITAL takes place March 1-5, 2021 on a virtual platform together with the embedded world Conference and the electronic displays Conference. Expert knowledge and state of the art innovations, including Samtec, are presented in a clearly structured and compact format.
Technical Presentations
Technical experts from Samtec and our partners will present throughout the event. Learn about the latest details on Samtec’s high-performance interconnect solutions targeted for embedded applications. Click the appropriate links for more details.
Monday, March 1
- Roundtable: Connectivity in Embedded Standards: The Mortar Between The Bricks
- Time: 8:00 AM – 8:30 AM EST/2:00 PM – 2:30 PM CST
- Roundtable: PCIe over Fiber Solutions in Embedded Computing Applications
- Time: 11:20 AM – 11:50 AM EST/5:20 PM – 5:50 PM CST
Tuesday, March 2, 2021
- Roundtable: High Speed Interconnect for Embedded Applications
- Time: 6:00 AM – 6:30 AM EST/12:00 PM – 12:30 PM CST
- Roundtable: Sensors to Servers: PICMG and Samtec Advance Embedded Open Standards
- Time: 8:00 AM – 8:30 AM EST/2:00 PM – 2:30 PM CST
- Live Webcast: COM-HPC: Pushing COMs to Far Greater Heights
- Time: 11:00 AM – 12:00 PM EST/ 5:00 PM – 6:00 PM CET
Wednesday, March 3, 2021
- Roundtable: Connectivity in Embedded Standards: The Mortar Between The Bricks
- Time: 9:00 AM – 9:30 AM EST/3:00 PM – 3:30 PM CST
- Roundtable: PICMG COM-HPC® – New Open Standard for High Performance Compute Modules
- Time: 1:15 PM – 1:45 PM EST/ 6:15 PM – 6:45 PM EST
Thursday, March 4, 2021
- Roundtable: High Speed Interconnect for Embedded Applications
- Time: 6:00 AM – 6:30 AM EST/12:00 PM – 12:30 PM CST
- Exhibitor Forum: 663 Gbps/cm2 – Samtec COM-HPC® Interconnect Solutions Increase Density and Speed
- Time: 7:30 AM – 7:50 AM EST/1:30 PM – 1:50 PM CST
- Roundtable: PCIe over Fiber Solutions in Embedded Computing Applications
- Time: 11:20 AM – 11:50 AM EST/5:20 PM – 5:50 PM CST
Friday, March 5, 2021
- Roundtable: PICMG COM-HPC® – New Open Standard for High Performance Compute Modules
- Time: 1:00 AM – 1:30 AM EST/ 7:00 AM CST – 7:30 Am CST
- Roundtable: Sensors to Servers: PICMG and Samtec Advance Embedded Open Standards
- Time: 8:00 AM – 8:30 AM EST/2:00 PM – 2:30 PM CST
PICMG COM-HPC Connectors
The new PICMG COM-HPC Specification provides system and interface flexibility by adopting a pair of 400 pin connectors link Modules to Carrriers. Samtec COM-HPC®-aligned connectors support existing and future interfaces such as PCIe® 5.0 (32 GT/s) and up to 100 Gb Ethernet. The connectors pairs support either a 5 mm or 10 mm stack height.
Additional Featured Products
Additional Samtec embedded interconnect solutions will be featured at embedded world 2021 DIGITAL. From front-panel to the backplane, embedded designers can count on key solutions from Samtec including:
- NovaRay® 112 Gbps PAM4 Extreme Density Arrays
- FireFly™ Micro Flyover System™
- AcceleRate® HD, AcceleRate® HP and AcceleRate® Cable Interconnect Solutions
- mPOWER® Ultra Micro Power HD Interconnect Solutions
- Precision RF Microwave/mmWave Interconnect Solutions
- Standards-based Interconnect Solutions (PICMG, VITA, PC-104 and more)
Samtec invites you to register now for the event. Please use Samtec Voucher Code: ew21457127 for your complementary event pass.