THE SAMTEC BLOG
Rapidly changing new technologies, accelerated product life cycles, IoT devices, wearable electronics and a host of other developments are driving a paradigm shift. What’s ahead? And what will it mean for you?
Tomorrow’s electronics will demand totally new solutions including smaller form factors, lower power consumption, and flexible designs. How will these new devices be packaged? At the Advanced Packaging Forum, you will learn about some of the latest assembly and packaging technologies—wafer-level packaging (WLP), fan out, and system in a package (SIP)—and how they will enable next-generation devices.
Steve Groothuis, CTO of Samtec Microelectronics, will answer these questions and more in his presentation “MEMS and Sensors Packaging – Leveraging More Than Moore Concepts” during the Advanced Packaging Forum session entitled “Sensing the Future: Enabling Applications for a Smarter World” on Thursday, July 14, 2016.
Here is Steve’s abstract:
Considering that the packaging of MEMS and sensors exceeds 60% of the total product costs, one must apply packaging-related lessons learned from other device package technologies (e.g., integrated circuits, electro-optics, and photovoltaics). The choosing the best package interconnect strategy and material sets will assure successful productization. This presentation will highlight the roles of innovation, chip-package co-design, design for manufacturability, and new materials/processes/equipment in MEMS & Sensors packaging.
Click here for more details on the Advanced Packaging Forum.